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NCV8660 Very Low Iq LD0 150 mA Regulator with RESET and Delay Time Select
The NCV8660 is a precision very low Iq low dropout voltage regulator. Quiescent currents as low as 28 mA typical make it ideal for automotive applications requiring low quiescent current with or without a load. Integrated control features such as Reset and Delay Time Select make it ideal for powering microprocessors. It is available with a fixed output voltage of 5.0 V and 3.3 V and regulates within 2.0%.
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DPAK 5-PIN DT SUFFIX CASE 175AA 8660yxG ALYWW
* * * * * * * * * *
Fixed Output Voltage of 5 V and 3.3 V 2.0% Output Voltage up to VBAT = 40 V Output Current up to 150 mA Microprocessor Compatible Control Functions: Delay Time Select RESET Output NCV Prefix for Automotive Site and Change Control AEC-Q100 Qualified Low Dropout Voltage Low Quiescent Current of 28 mA Typical Stable Under No Load Conditions Protection Features: Thermal Shutdown Short Circuit These are Pb-Free Devices
1
5
1 8 8 1 SOIC-8 FUSED CASE 751 1 660yx ALYWW G
x y A L Y WW G or G
= 5 for 5 V Output, 3 for 3.3 V Output = 1 for 8 ms, 128 ms Reset Delay, = 3 for 16 ms, 64 ms Reset Delay = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
Applications

* Automotive:
*
Body Control Module Instrument and Clusters Occupant Protection and Comfort Powertrain Battery Powered Consumer Electronics
IN NCV8660 OUT COUT 2.2 mF OUT
ORDERING INFORMATION
See detailed ordering and shipping information in the dimensions section on page 12 of this data sheet.
VBAT 13.2 V
CIN 0.1 mF
DT DT
RO GND
RO
Figure 1. Application Diagram
(c) Semiconductor Components Industries, LLC, 2009
January, 2009 - Rev. 9
1
Publication Order Number: NCV8660/D
NCV8660
PIN DESCRIPTIONS
Pin DPAK 1 2 3, Tab 4 5 SOIC-8 FUSED 1 2 5-8 3 4 Symbol IN RO GND DT OUT Function Input Supply Voltage. 0.1 mF bypass capacitor to GND at the IC. Reset Output. CMOS compatible output. Goes low when VOUT drops by more than 7% from nominal. Ground Reset Delay Time Select. Short to GND or connect to OUT to select time. Regulated Voltage Output. 2.2 mF to ground for typical applications.
IN
OUT
Current Limit and Thermal Shutdown
+ -
Vref1 GND
DT
- +
Timing Circuit
RO
Vref2
Figure 2. Block Diagram
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NCV8660
ABSOLUTE MAXIMUM RATINGS
Rating Input Voltage (IN) Input Current Output Voltage (OUT) DC Transient, t < 10 s (Note 1) Output Current (OUT) Storage Temperature Range DT (Reset Delay Time Select) Voltage (Note 2) DT (Reset Delay Time Select) Current (Note 2) RO (Reset Output) Voltage DC Transient, t < 10 s RO (Reset Output) Current ESD CAPABILITY ESD Capability, Human Body Model (Note 3) ESD Capability, Machine Model (Note 3) ESD Capability, Charged Device Model (Note 3) THERMAL RESISTANCE Junction-to-Case (Note 4) Junction-to-Ambient (Note 4) Junction-to-Tab (Note 4) Junction-to-Ambient (Note 4) Junction-to-Lead (pin 6) (Note 4) LEAD SOLDERING TEMPERATURE AND MSL Moisture Sensitivity Level DPAK 5 SOIC-8 FUSED MSL SLD - 1 3 265 peak - C DPAK 5 DPAK 5 DPAK 5 SOIC-8 FUSED SOIC-8 FUSED RqJC RqJA RqJT RqJA RqJT 15 66 4.0 104 33 C/W C/W C/W C/W C/W ESDHB ESDMM ESDCDM -2.0 -200 -1.0 2.0 200 1.0 kV V kV Symbol VIN IIN VOUT Min -0.3 -1.0 -0.3 -0.3 -1.0 -55 -0.3 -1.0 -0.3 -0.3 -1.0 Max 40 - 5.5 16 Current Limited 150 16 1.0 5.5 16 1.0 Unit V mA V
IOUT TSTG VDT IDT VRO
mA C V mA V
IRO
mA
Lead Temperature Soldering: SMD style only, Reflow (Note 5) Pb-Free Part 60 - 150 sec above 217C, 40 sec max at peak
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The output voltage must not exceed the input voltage. 2. External resistor required to minimize current to less than 1 mA when the control voltage is above 16 V. 3. This device series incorporates ESD protection and is tested by the following methods: ESD HBM tested per AEC-Q100-002 (EIA/JESD22-A114) ESD MM tested per AEC-Q100-003 (EIA/JESD22-A115) ESD CDM tested per EIA/JESD22/C101, Field Induced Charge Model 4. Values represented typical steady-state thermal performance on 1 oz. copper FR4 PCB with 1 in2 copper area. 5. Per IPC / JEDEC J-STD-020C.
OPERATING RANGE
Pin Symbol, Parameter VIN, Input Voltage Operating Range Junction Temperature Range Symbol VIN TJ Min 4.5 -40 Max 40 150 Unit V C
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NCV8660
ELECTRICAL CHARACTERISTICS 5.5 V < VIN < 40 V, -40C TJ +150C, unless otherwise specified
Characteristic GENERAL Quiescent Current Thermal Shutdown (Note 6) Thermal Hysteresis (Note 6) OUT Output Voltage VOUT 6 V VIN 16 V, 0.1 mA IOUT 150 mA 6 V VIN 40 V, 0.1 mA IOUT 100 mA 5.6 V VIN 16 V, 0 mA IOUT 150 mA, -40C TJ +125C Output Voltage VOUT 5.5 V VIN 16 V, 0.1 mA IOUT 150 mA 5.5 V VIN 40 V, 0.1 mA IOUT 100 mA Output Current Limit Output Current Limit, Short Circuit Load Regulation Line Regulation Dropout Voltage - 5.0 V Only ICL ISCKT DVOUT DVOUT VDR OUT = 96% x VOUT nominal OUT = 0 V VIN = 13.2 V, IOUT = 0.1 mA to 150 mA IOUT = 5 mA, VIN = 6 V to 28 V IOUT = 100 mA, (Note 7) VDR = VIN - VOUT, (DVOUT = -100 mV) IOUT = 150 mA, (Note 7) VDR = VIN - VOUT, (DVOUT = -100 mV) Output Load Capacitance Power Supply Ripple Rejection DT (Reset Delay Time Select) Threshold Voltage Input Current RO, Reset Output RESET Threshold RESET Threshold Hysteresis RO Output Low RO Output High (OUT-RO) Reset Reaction Time Input Voltage Reset Threshold RESET Delay with DT Selection Delay Time Out of RESET - 8 ms version - 16 ms version - 32 ms version - 64 ms version - 128 ms version tdRx VOUT into regulation to RO High 5.0 10 20 40 80 8.0 16 32 64 128 11.5 23 46 92 184 msec VRf VRhys VRL VRH tRR VIN_RT 10 kW RESET to OUT, VOUT = 4.5 V 10 kW RESET to GND VOUT into UV to RESET Low VIN Decreasing, VOUT > VRT VOUT decreasing 90 - - VOUT -0.4 16 - 93 2.0 0.2 VOUT -0.2 25 3.8 96 - 0.4 VOUT 38 4.25 %VOUT %VOUT V V msec V High Low DT = 5 V 2 - - - - - - 0.8 1.0 V V mA CO PSRR Output capacitance for stability VIN = 13.2 V, 0.5 VPP, 100 Hz 4.9 4.9 4.9 3.234 3.234 205 205 -40 -20 - - 2.2 - 5.0 5.0 5.0 3.3 3.3 - - 10 0 0.225 0.30 - 60 5.1 5.1 5.1 3.366 3.366 525 525 40 20 0.45 0.60 - - mF dB mA mA mV mV V V V Iq TSD THYS 100mA < IOUT < 150mA, VIN = 13.2V, TJ = 25C 100mA < IOUT < 150mA, VIN = 13.2V, TJ 85C - - 150 - 25 - 175 25 30 40 195 - C C mA Symbol Conditions Min Typ Max Unit
6. Not production tested, guaranteed by design. 7. Dropout at a given current level is defined as the voltage difference of VIN to VOUT with VIN decreasing until the output drops by 100 mV.
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NCV8660
TYPICAL OPERATING CHARACTERISTICS
5.0 4.995 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 4.99 4.985 4.98 4.975 4.97 4.965 Iout = 0 mA, 150 mA 4.96 -40 -20 0 20 40 3.315 3.310 3.305 3.300 3.295 3.290 3.285 3.280 3.275 3.270 3.265 Iout = 0 mA, 150 mA 3.260 0 20 40 -40 -20
60
80
100 120
140 160
60
80
100 120
140 160
TEMPERATURE (C)
TEMPERATURE (C)
Figure 3. Output Voltage vs. Temperature (OUT = 5 V)
5.0 4.995 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 4.99 4.985 4.98 4.975 4.97 4.965 4.96 4.955 0 20 40 60 150C 80 100 120 140 160 -40C 25C 3.310 3.305 3.300 3.295 3.290 3.285 3.280 3.275 3.270 3.265 3.260 3.255
Figure 4. Output Voltage vs. Temperature (OUT = 3.3 V)
25C -40C
150C
0
20
40
60
80
100
120
140
160
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
Figure 5. Output Voltage vs. Output Current (OUT = 5 V)
6 5 4 3 2 25C 1 0 150C 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 -40C 3.5 3.0 2.5 2.0 1.5
Figure 6. Output Voltage vs. Output Current (OUT = 3.3 V)
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
150C 25C 1.0 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5
-40C
4
4.5
5
5.5
6
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Figure 7. Output Voltage vs. Input Voltage (RLOAD = 51 k, Iout = 100 mA, OUT = 5 V)
Figure 8. Output Voltage vs. Input Voltage (RLOAD = 51 k, Iout = 100 mA, OUT = 3.3 V)
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NCV8660
TYPICAL OPERATING CHARACTERISTICS
380 370 360 350 340 330 320 310 -40 -20 Vin = 13.2 V 0 20 40 60 80 100 120 140 160 TEMPERATURE (C) DROPOUT VOLTAGE (mV) CURRENT LIMIT (mA) 600 500 400 300 200 100 0 150C 25C
-40C 0 25 50 75 100 125 150
OUTPUT CURRENT (mA)
Figure 9. Current Limit vs. Temperature
Figure 10. Dropout Voltage vs. Output Current
600 500 1 mA 400 300 200 100 0 -40 -20
150 mA 125 mA 100 mA 75 mA 50 mA 25 mA 10 mA 0 20 40 60 80 100 120 140 160 QUIESCENT CURRENT (mA)
40 35 30 25 20 15 10 5 0 0 2 4 6 8 10 Iout = 0 mA 12 14 16
DROPOUT VOLTAGE (mV)
TEMPERATURE (C)
INPUT VOLTAGE (V)
Figure 11. Dropout Voltage vs. Temperature
Figure 12. Quiescent Current vs. Input Voltage
29 28.5 QUIESCENT CURRENT (mA) 28 27.5 27 26.5 26 25.5 25 24.5 24 23.5 -40 -20 0 20 40 60 80 100 120 140 160 QUIESCENT CURRENT (mA)
35 30 25 20 15 10 5 0 0 20 40 60 80 100 120 140 160 150C 25C -40C
TEMPERATURE (C)
OUTPUT CURRENT (mA)
Figure 13. Quiescent Current vs. Temperature
Figure 14. Quiescent Current vs. Output Current
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NCV8660
TYPICAL OPERATING CHARACTERISTICS
Figure 15. Load Transient (VIN = 13.2 V, OUT = 5 V)
Figure 17. Load Transient (VIN = 13.2 V, OUT = 3.3 V)
IN
OUT
Cout = 2.2 mF Iout = 150 mA
Figure 16. Line Transient (OUT = 5 V)
Figure 18. Line Transient (OUT = 3.3 V)
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NCV8660
TYPICAL OPERATING CHARACTERISTICS
80 70 60 MAG (dB) 50 40 30 20 10 0 10 VIN = 13.2 V COUT = 4.7 mF IOUT = 100 mA 100 1k 10 k FREQUENCY 100 k 1M 10 M MAG (dB)
80 70 60 50 40 30 20 10 0 10 VIN = 13.2 V COUT = 4.7 mF IOUT = 150 mA 100 1k 10 k 100 k 1M 10 M
FREQUENCY
Figure 19. Ripple Rejection vs. Frequency (VIN = 13.2 V, IOUT = 100 mA)
10000 1000 100 ESR (W) 10 1 0.1 0.01 Vin = 13.2 V CLOAD = 2.2 mF 0 20 40 60 80 100 120 140 160 10000 1000 100 ESR (W) Stable Region 10 1 0.1 0.01
Figure 20. Ripple Rejection vs. Frequency (VIN = 13.2 V, IOUT = 150 mA)
Unstable Region 25C -40C 125C
25C -40C
Unstable Region 125C
Stable Region
Vin = 13.2 V CLOAD = 2.2 mF 0 20 40 60 80 100 120 140 160
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
Figure 21. Output Capacitor ESR vs. Output Current (OUT = 5 V)
5.5 5.0 4.5 OUTPUT VOLTAGE (V) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 25 50 75 100
Figure 22. Output Capacitor ESR vs. Output Current (OUT = 3.3 V)
Temperature Increasing Temperature Decreasing
125
150
175
TEMPERATURE (C)
Figure 23. Thermal Shutdown vs. Temperature
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NCV8660
DETAILED OPERATING DESCRIPTION
General Current Limit
The NCV8660 is a 5 V and 3.3 V linear regulator providing low drop-out voltage for 150 mA at low quiescent current levels. Also featured in this part is a reset output with selectable delay times. Delay times are selectable via part selection and control through the Delay Time Select (DT) pin. No pull-up resistor is needed on the reset output (RO). Pull-up and pull-down capability are included. Only a small bypass capacitor on the input (IN) supply pin and output (OUT) voltage pin are required for normal operation. Thermal shutdown functionality protects the IC from damage caused from excessively high temperatures appearing on the IC.
Output Voltage
Current limit is provided on OUT to protect the IC. The minimum specification is 205 mA. Current limit is specified under two conditions (OUT = 96% x OUT nominal) and (OUT = 0 V). No fold-back circuitry exists. Any measured differences can be attributed to change in die temperature. The part may be operated up to 205 mA provided thermal die temperature is considered and is kept below 150C. Degradation of electrical parameters at this current is expected at these elevated levels. A reset (RO) will not occur with a load less than 205 mA.
Reset Output
Output stability is determined by the capacitor selected from OUT to GND. The NCV8660 has been designed to work with low ESR (equivalent series resistance) ceramic capacitors. The device is extremely stable using virtually any capacitor 2.2 mF and above. Reference the Output Capacitor Stability graph in Figure 21. The output capacitor value will affect overshoot during power-up. A lower value capacitor will cause higher overshoot on the output. System evaluation should be performed with minimum loading for evaluation of overshoot. Selection of process technology for the NCV8660 allows for low quiescent current independent of loading. Quiescent current will remain flat across the entire range of loads providing a low quiescent current condition in standby and under heavy loads. This is highly beneficial to systems requiring microprocessor interrupts during standby mode as duty cycle and load changes have no impact on the standby current. Reference Figure 14 for Quiescent Current vs Output Current.
A reset signal is provided on the Reset Output (RO) pin to provide feedback to the microprocessor of an out of regulation condition. This is in the form of a logic signal on RO. Output (OUT) voltage conditions below the RESET threshold cause RO to go low. The RO integrity is maintained down to OUT = 1.0 V. The Reset Output (RO) circuitry includes an active internal pullup to the output (OUT) as shown in Figure 24. No external pullup is neccessary.
OUT
RO Reset Control Signal
Figure 24. Reset Output Circuitry
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NCV8660
IN
t OUT Reset Delay Time
t < Reset Reaction Time OUT Reset Threshold plus Hysteresis
OUT Reset Threshold
t RO
t Reset Threshold Plus Hysteresis Thermal Shutdown Voltage Dip at Input Reset Delay Time Secondary Spike Overload at Output Reset Delay Time Reset Reaction Time
Thermal Shutdown minus Thermal Hysteresis
Figure 25. Reset Timing
During power-up (or restoring OUT voltage from a reset event), the OUT voltage must be maintained above the Reset threshold for the Reset Delay time before RO goes high. The time for Reset Delay is determined by the choice of IC and the state of the DT pin.
Reset Delay Time Select
The Delay Time select (DT) pin is logic level controlled and provides Reset Delay time per the chart. Note the DT pin is sampled only when RO is low, and changes to the DT pin when RO is high will not effect the reset delay time.
Thermal Shutdown
Selection of the NCV8660 device and the state of the DT pin determines the available Reset Delay times. The part is designed for use with DT tied to ground or OUT, but may be controlled by any logic signal which provides a threshold between 0.8 V and 2 V. The default condition for an open DT pin is the slower Reset time (DT = GND condition). Times are in pairs and are highlighted in the chart below. Consult factory for availability.
DT=GND Reset Time NCV86601 NCV86602 NCV86603 NCV86604 8 ms 8 ms 16 ms 32 ms DT=OUT Reset Time 128 ms 32 ms 64 ms 128 ms
When the die temperature exceeds the Thermal Shutdown threshold, a Thermal Shutdown event is detected OUT is turned off, and RO goes low. The IC will remain in this state until the die temperature moves below the shutdown threshold (175C typical) minus the hysteresis factor (25C typical). The output will then turn back on and RO will go high after the RESET Delay time.
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NCV8660
110 100 ThetaJA (C/W) 90 80 70 60 50 40 0 100 200 300 400 500 600 Theta JA curve Power curve with PCB 1 oz cu MAX POWER (W) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 700 180 170 160 ThetaJA (C/W) 150 140 120 110 90 80 Theta JA curve Power curve with PCB 1 oz cu MAX POWER (W) 1.3 1.2 1.1 1.0 0.9 0.8 0.7 700
130
100
0
100
200
300
400
500
600
COPPER HEAT SPREADER AREA (mm2)
COPPER HEAT SPREADER AREA (mm2)
Figure 26. RqJA vs. PCB Copper Area (DPAK)
Figure 28. RqJA vs. PCB Copper Area (SOIC-8 Fused)
100 10 R(t), (C/W) 1 0.1 0.01
0.5 0.2 0.1 0.05 0.02 0.01 Single Pulse
0.001 0.000001
Psi Tab-A 0.00001 0.0001 0.001 0.01 0.1 PULSE TIME (sec) 1 10 100 1000
Figure 27. Transient Thermal Response (DPAK) Cu Area = 645 mm2
100
0.5 0.2 10 0.1 0.05 0.02 1 0.01 Single Pulse
R(t), (C/W)
0.1 0.01
0.001 0.000001
Psi L-A 0.00001 0.0001 0.001 0.01 0.1 PULSE TIME (sec) 1 10 100 1000
Figure 29. Transient Thermal Response (SOIC-8 Fused) Cu Area = 645 mm2
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NCV8660
ORDERING INFORMATION
Device NCV86601DT50RKG NCV86602DT50RKG NCV86603DT50RKG NCV86604DT50RKG NCV86601D50G NCV86601D50R2G NCV86602D50R2G NCV86603D50R2G NCV86604D50R2G NCV86601DT33RKG NCV86602DT33RKG NCV86603DT33RKG NCV86604DT33RKG NCV86601D33R2G NCV86602D33R2G NCV86603D33R2G NCV86604D33R2G 3.3 V 5.0 V Output Voltage Reset Delay Time, DT to GND 8 ms 8 ms 16 ms 32 ms 8 ms 8 ms 8 ms 16 ms 32 ms 8 ms 8 ms 16 ms 32 ms 8 ms 8 ms 16 ms 32 ms Reset Delay Time, DT to OUT 128 ms 32 ms 64 ms 128 ms 128 ms 128 ms 32 ms 64 ms 128 ms 128 ms 32 ms 64 ms 128 ms 128 ms 32 ms 64 ms 128 ms SOIC-8 FUSED (Pb-Free) 2500 / Tape & Reel DPAK (Pb-Free) 2500 / Tape & Reel SOIC-8 FUSED (Pb-Free) 2500 / Tape & Reel 98 Units / Rail DPAK (Pb-Free) 2500 / Tape & Reel Package Shipping
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
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NCV8660
PACKAGE DIMENSIONS
DPAK 5, CENTER LEAD CROP DT SUFFIX CASE 175AA-01 ISSUE A
-T- B V R C E R1 Z U
DIM A B C D E F G H J K L R R1 S U V Z SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.020 0.028 0.018 0.023 0.024 0.032 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.045 BSC 0.170 0.190 0.185 0.210 0.025 0.040 0.020 --- 0.035 0.050 0.155 0.170 MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.51 0.71 0.46 0.58 0.61 0.81 4.56 BSC 0.87 1.01 0.46 0.58 2.60 2.89 1.14 BSC 4.32 4.83 4.70 5.33 0.63 1.01 0.51 --- 0.89 1.27 3.93 4.32
S
A
1234 5
K F L D G
5 PL
J H 0.13 (0.005) T
M
SOLDERING FOOTPRINT*
6.4 0.252 2.2 0.086
5.8 0.228
0.34 5.36 0.013 0.217
10.6 0.417
0.8 0.031
SCALE 4:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NCV8660
PACKAGE DIMENSIONS
SOIC-8 NB CASE 751-07 ISSUE AJ
A
8 5
-X-
B
1
S
4
0.25 (0.010)
M
Y
M
-Y- G
K
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. DIM A B C D G H J K M N S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
C -Z- H D 0.25 (0.010)
M SEATING PLANE
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
SOLDERING FOOTPRINT*
1.52 0.060
7.0 0.275
4.0 0.155
0.6 0.024
1.270 0.050
SCALE 6:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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NCV8660/D

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